SOLDER WICK NO-CLEAN 25/PK TECH-SPRAY
Item No: 1823-5F
Protect your electronic assemblies from latent field failures with the high-reliability Techspray 1823-5F No-Clean Desoldering Braid. Featuring a Size #4 Blue Label width of 0.098 inches (2.5mm), this pre-fluxed copper solder wick is the ideal choice for safely replacing components and removing excess solder bridging. Standard fluxes can leave active ionic residues behind on your boards; if not cleaned properly, these residues collect and form microscopic, branch-like structures called dendrites. Over time, these dendrites grow and bridge the gaps between traces or leads, causing devastating short circuits and costly product returns.This premium no-clean desoldering wick eliminates that risk entirely by utilizing an advanced chemistry that leaves zero ionic flux residues. To use it, simply place the 5-foot pure copper braid over the joint and apply your soldering iron. Once both elements reach the alloy's melting point, the integrated flux activates, instantly drawing molten solder up into the weave through powerful capillary action. By minimizing the contact time required to clear a joint, the 1823-5F actively shields sensitive components from thermal fatigue while preserving the long-term quality and reliability of your circuit boards.
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$169.75
